Mems micro-mirror assembly

ABSTRACT

A MEMS micro-mirror assembly ( 250, 300, 270, 400 ) comprising, a MEMS device ( 240 ) which comprises a MEMS die ( 241 ) and a magnet ( 231 ); a flexible PCB board ( 205 ) to which the MEMS device ( 240 ) is mechanically, and electrically, connected; wherein the flexible PCB board ( 205 ) further comprises a first extension portion ( 205   b ) which comprises a least one electrical contact ( 259   a,b ) which is useable to electrically connect the MEMS micro-mirror assembly ( 250, 300, 270, 400 ) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly ( 250, 300, 270, 400 ).

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of, claims the benefit of andpriority to, previously filed U.S. patent application Ser. No.14/382,724 entitled “MEMS MICRO-MIRROR ASSEMBLY” filed on Sep. 3, 2014,which is a national stage application of PCT/EP2013/052682 filed in Feb.11, 2013, which claims the benefit of U.S. Provisional Application Ser.No. 61/608,434 filed Mar. 8,2012; the subject matter of all of the aboveare hereby incorporated by reference in their entirety.

FIELD OF THE INVENTION

The present invention concerns a MEMS micro-mirror assembly; and inparticular, but not exclusively, to a MEMS micro-mirror assembly whichcomprises a MEMS micro-mirror device mounted on a flexible PCB board.

DESCRIPTION OF RELATED ART

A MEMS micro-mirror device is a device that contains an optical MEMS(Micro-Electrical-Mechanical-System). The optical MEMS may comprise anelliptical, cylindrical, rectangular, square or random shapemicro-mirror that is adapted to move and to deflect light over time. Themicro-mirror is connected by torsional arms to a fixed part and can tiltand oscillate along one or two axis. For example, it can oscillatevertically and horizontally. Different actuation principles can be used,including electrostatic, thermal, electro-magnetic or piezo-electric.MEMS micro-mirror devices are known in which the area of thesemicro-mirrors are around a few mm². In this case, the dimensions of theMEMS micro-mirror device, comprising the packaging, is around ten mm².This MEMS micro-mirror device is usually made of silicon, and can beencapsulated in a package that can include the driving actuationelectronics. Various optical components, such as for example lenses,beam combiner, quarter-wave plates, beam splitter and laser chips, areassembled with the packaged MEMS to build a complete system.

A typical application of the MEMS micro-mirror devices is for opticalscanning and projection systems. In a projection system, a 2-D or 3-Dimage or video can be displayed on any type of projection surface. In acolor system, each pixel of the image is generated by combiningmodulated red, green and blue laser light, by means of, for example, abeam combiner, to generate a combined light beam which defines a pixelof the image or video. The MEMS micro-mirror in the MEMS micro-mirrordevice directs the combined light beam to a projection surface where thepixel of the image or video is displayed. Successive pixels of the imageor video are display in this manner. By means of its oscillations, theMEMS micro-mirror within the MEMS micro-mirror device will continuouslyscan the combined light beam from left to right, right to left and fromtop to bottom (or according to a different trajectory including e.g.Lissajou or raster trajectories) so that all the pixels of the image, orvideo, are displayed on the projection surface, successively,pixel-by-pixel. The MEMS micro-mirror will oscillate about itsoscillation axes at a frequency which ensures that the combined lightbeam is scanned across the projection surface at such a speed that acomplete image is visible to a person viewing.

Typically, the MEMS micro-mirror in a MEMS micro-mirror device is ableto oscillate along a single oscillation axis. Therefore, in order todisplay a 2-D image on a screen a projection system will require twoMEMS micro-mirror devices; a first MEMS micro-mirror device which isrequired to scan the combined light beam along the horizontal and asecond MEMS micro-mirror device which is required to scan the combinedlight beam along the along the vertical. Alternatively, the MEMSmicro-mirror in a MEMS micro-mirror device could be configured such thatit can be oscillated about two orthogonal oscillation axes.

Referring now to FIGS. 5a and 5b which show a known MEMS micro-mirrordevice 1. FIG. 5a provides a top view of the MEMS micro-mirror device 1and FIG. 5b shows a cross sectional view of the MEMS micro-mirror device1, taken along A-A′ of FIG. 5 a.

The MEMS micro-mirror device 1 comprises a first support frame 2. Afirst torsional arm 3 a and second torsional arm 3 b connect a moveablepart 4 to the support frame 2. The moveable part 4 comprises amicro-mirror 8 mounted thereon. In this embodiment the support frame 2is fixed (i.e. immovable). The first and second torsional arms 3 a,bdefine a first oscillation axis 7 for the moveable part 4. A firstactuation coil 5 is supported on, and connected to, the moveable part 4.The first actuation coil 5 is arranged to extend, from a firstelectrical contact 9 a which is located on the support frame 2, alongthe first torsional arm 3 a, around the perimeter of the moveable part 4and back along the first torsional arm 3 a to a second electricalcontact 9 b which is located on the support frame 2.

The first support frame 2, first and second torsional arms 3 a,b, themoveable part 4, the micro-mirror 8, and first actuation coil 5, definecollectively a MEMS die 10. As shown in FIG. 5b the MEMS die 10 ismounted on, and fixed to (using glue for example), a magnet 6 such thefirst actuation coil 5 is submerged in the magnetic field ‘B’ generatedby the magnet 6. Preferably the MEMS die 10 is fixed at the firstsupport frame 2 to the magnet 6; this is usually achieved by providingglue between the first support frame 2 of the MEMS die 10 and the magnet6.

During use, an electric current ‘I’ is passed through the firstactuation coil 5. As the first actuation coil 5 is submerged in themagnetic field ‘B’ created by the magnet 6, the actuation coil 5 willprovide a Laplace force which will be applied to the moveable part 4.The Laplace force will cause the moveable part 4, and thus the MEMSmicro-mirror 8, to oscillate about its first oscillation axis 7.

It should be understood that the MEMS micro-mirror device 1 couldalternatively be configured to enable oscillation of the moveable part 4about two orthogonal axes, so that the MEMS micro-mirror 8 can scanlight in two dimensions (typically along the horizontal and vertical).FIG. 6 shows a MEMS micro-mirror device 100 which is configured toenable oscillation of the moveable part 4 about two orthogonal axes.

The MEMS micro-mirror device 20 has many of the same features of theMEMS micro-mirror device 1 shown in FIGS. 5a and 5b ; however, in theMEMS micro-mirror device 20 the support frame 2 is configured to bemoveable; the support frame 2 is configured such that it can oscillateabout a second oscillation axis 17, which is orthogonal to the firstoscillation axis 7.

The MEMS micro-mirror device 20 further comprises a fixed part 12 (i.e.an immovable part); the support frame 2 is connected to the fixed part12 via third and fourth torsional arms 13 a,b. The third and fourthtorsional arms 13 a,b, define the second oscillation axis 17. A secondactuation coil 15 is connected to the support frame 2. This secondactuation coil 15 will also be submerged by the magnetic field ‘B’generated by the magnet 6.

A second actuation coil 15 is supported on, and connected to, thesupport frame 2. The second actuation coil 15 is arranged to extend,from a first electrical contact 19 a which is located on the fixed part12, along the third torsional arm 13 a, around the perimeter of thesupport frame 2 and back along the third torsional arm 13 a to a secondelectrical contact 19 b which is located on the fixed part 12. It shouldbe noted that the second actuation coil 15 does not extend along thefourth torsional arm 13 b.

Furthermore, in the MEMS micro-mirror device 20 the first and secondelectrical contacts 9 a, 9 b for the first actuation coil 5 are locatedon the fixed part 12 and thus the first actuation coil 5 is arranged toalso extend along the support frame 2 and the third and fourth torsionalarms in order to electrically connect to the first and second electricalcontacts 9 a, 9 b.

The first support frame 2, first and second torsional arms 3 a,b, themoveable part 4, the micro-mirror 8, and first actuation coil 5, thefixed part 12, second actuation coil 15, third and fourth torsional arms13 a,b, define collectively a MEMS die 90. The MEMS die 90 is mountedon, and fixed to (using glue for example), a magnet 6 such the firstactuation coil 5 is submerged in the magnetic field ‘B’ generated by themagnet 6. Preferably the MEMS die 90 is secured at the fixed part 12 tothe magnet 6; this is usually achieved by providing glue between thefixed part 12 of the MEMS die 90 and the magnet 6.

During use an electric current ‘i’ is passed through the first actuationcoil 5 which is connected to the moveable part 4. As the first actuationcoil 5 is submerged in the magnetic field ‘B’ created by the magnet 6the first actuation coil 5 will provide a Laplace force which will beapplied to the moveable part 4. The Laplace force will cause themoveable part 4, and thus the micro-mirror 8, to oscillate about thefirst oscillation axis 7. An electric current ‘I’ is also passed throughthe second actuation coil 15 which is connected to the support frame 2.As the second actuation coil 15 is also submerged in the magnetic field‘B’ created by the magnet 6, the second actuation coil 15 will provide aLaplace force which will be applied to the support frame 2. The Laplaceforce which is applied to the support frame 2 by the second actuationcoil 15 will cause the support frame 2, and thus the moveable part 4which is connected to the support frame 2 via the torsional arms 13 a,b,to oscillate about the second oscillation axis 17. Accordingly, the MEMSmicro-mirror 8 will be oscillated about the first and second orthogonaloscillation axes 7,17. If the micro-mirror 8 reflects light as it isoscillating about the first and second orthogonal oscillation axes 7,17the reflected light will be scanned in two dimensions e.g. horizontaland vertical. This will, for example, enable combined light beams whichthe micro-mirror 8 receives, to be scanned across the area of aprojection screen in, for example, a zig-zag or raster pattern.

To integrate the MEMS micro-mirror devices 1,20 into a projection system(or other system), the MEMS micro-mirror device 1,20 is first mounted ona rigid PCB board and electrically connected to the rigid PCB boardusing wire bonds, to form a MEMS micro-mirror assembly. The MEMSmicro-mirror assembly is then electrically connected to the projectionsystem (or other system) using wire bonds or other electricalconnectors, so that the MEMS micro-mirror assembly is integrated in theprojection system (or other system). Disadvantageously, additional wirebonds or other electrical connectors are required to integrate the MEMSmicro-mirror assembly into the projection system. Furthermore, thesewire bonds, or electrical connectors, are typically fragile and caneasily break during handling, thus making it difficult to successfullyintegrate the MEMS micro-mirror assembly into the projection system (orother system).

It is an aim of the present invention to obviate or mitigate at leastsome of the above-mentioned disadvantages.

BRIEF SUMMARY OF THE INVENTION

According to the present invention there is provided a MEMS micro-mirrorassembly comprising, a MEMS device which comprises a MEMS die and amagnet; a flexible PCB board to which the MEMS device is mechanically,and electrically, connected; wherein the flexible PCB board furthercomprises a first extension portion which comprises a least oneelectrical contact which is useable to electrically connect the MEMSmicro-mirror assembly to another electrical component.

The MEMS die may have some or all of the features of the MEMS die of theMEMS devices shown in FIGS. 5a,b and 6.

The MEMS device may be mounted on the flexible PCB board.

The flexible PCB board may be interposed between the MEMS die andmagnet. In this case the MEMS die and magnet may be mounted on opposingsurfaces of the flexible PCB board.

The MEMS device may be mechanically connected to the flexible PCB boardby means of glue. The glue may comprise epoxy glue, silicon glue,cyano-acrylate. Advantageously such glues can be cured for improving theadhesion.

The first extension portion may further comprise a least one electricalcontact to which the MEMS device is electrically connected. The firstextension portion comprises a plurality of electrical contacts to whichthe MEMS device is electrically connected

The flexible PCB board further may further comprise a second extensionportion which comprises a least one electrical contact to which the MEMSdevice is electrically connected. The second extension portion comprisesa plurality of electrical contacts to which the MEMS device iselectrically connected. Preferably the MEMS device is electricallyconnected to one or more electrical contacts which are provided onsecond extension portion only.

The MEMS device may comprise at least one electrical contact. The atleast one electrical contact may be provided on the MEMS die. The MEMSdevice may comprise a plurality of electrical contacts. The at least oneelectrical contact may be used to electrically connect the MEMS deviceto the flexible PCB board.

The MEMS micro-mirror assembly may further comprise one or more wirebonds which electrically connect an electrical contact on the MEMSdevice to an electrical contact on the first extension portion, so thatthe MEMS device is electrically connected to the flexible PCB board.

The MEMS micro-mirror assembly may further comprise one or more wirebonds which electrically connect the electrical contact on the MEMSdevice to an electrical contact on the second extension portion, so thatthe MEMS device is electrically connected to the flexible PCB board.

The MEMS micro-mirror assembly may comprise a plurality of wire bonds.The MEMS micro-mirror assembly may comprise a plurality of wire bondswhich electrically connect an electrical contact on the MEMS device toan electrical contact on the first and/or second extension portion ofthe flexible PCB board, so that the MEMS device is electricallyconnected to the flexible PCB board. Preferably a plurality of wirebonds will electrically connect each of a plurality of electricalcontacts on the MEMS device to each of a plurality of electricalcontacts on the first and/or second extension portion of the flexiblePCB board, so that the MEMS device is electrically connected to theflexible PCB board. Using multiple wire bonds to electrically connecteach of the electrical contacts will advantageously increase themechanical stability of the assembly.

The electrical connection between each of the electrical contacts on themirror and the electrical contacts on the flexible PCB board may be madeusing conductive glue which is provided between the electrical contactand wire bond. The electrical connection between each of the electricalcontacts and the wire bonds may be glop-top, thick glue, epoxy orresist.

The MEMS micro-mirror assembly may further comprise protective materialwhich is arranged to form an enclosure which encloses the wire bonds.

The flexible PCB board may comprise a PCB foil.

One or more electronic components are mounted on the flexible PCB board,in addition to the MEMS micro-mirror assembly. The one or moreelectronic components may comprise, electrical connectors, photodiode,active or passive electronic components for example.

The flexible PCB board may further comprise alignment marks tofacilitate positioning the MEMS device on the flexible PCB board. Thealignment marks may also facilitate the alignment of the MEMS die on themagnet. Alignment marks can be made using any suitable means e.g. byscreen printing, by a photolithography process or laser writing.

The flexible PCB board may comprise one or more areas which aremechanically re-enforced. In the one or more areas which aremechanically re-enforced the flexible PCB board may be configured to bethicker than the other areas of the flexible PCB board, therebyproviding for increased mechanical strength in these one or more areas.The areas which are mechanically re-enforced will have a highermechanical strength. For example, the flexible PCB board may bere-enforced in the regions of the wire bonds only, so as to preventmechanical stresses, which are applied to the flexible PCB board, fromdetaching the wire bonds from electrical contacts.

The flexible PCB board may comprise conductive lines which electricallyconnect the electrical contacts which are on the flexible PCB board. Forexample, the conductive lines may electrically connect electricalcontacts, to which the MEMS device is electrically connected, to saidelectrical contacts which are useable to electrically connect the MEMSmicro-mirror assembly to another electrical component. The flexible PCBboard may be mechanically reinforced in the regions adjacent toconductive lines.

The flexible PCB board may be dimensioned such that edge the PCB boardare aligned with edges of the MEMS device. Preferably, the flexible PCBboard is dimensioned such that three edges of the PCB board are alignedwith three edges of the MEMS device. Most preferably, the flexible PCBboard is dimensioned such that two edges of the PCB board are alignedwith two edges of the MEMS device. This will provide for a compactassembly.

The or each electrical contact on the MEMS device and/or the or eachelectrical contact on the first and/or second extension portion of theflexible PCB board may comprise Anisotrope Conductive Film (ACF).

Each of the contacts which comprise Anisotrope Conductive Film (ACF) mayeach further comprise a metal part.

The electrical contacts on the MEMS device may directly contact theelectrical contacts on the flexible PCB board to electrically connectthe MEMS device and flexible PCB board. The electrical contacts on theMEMS device may connect directly to the electrical contacts on theflexible PCB board so that the MEMS device is electrically andmechanically connected to the flexible PCB board. For example, theelectrical contacts on the MEMS device may be mounted on the electricalcontacts on the flexible PCB board so that the MEMS device iselectrically and mechanically connected to the flexible PCB board. Theelectrical contact on the flexible PCB board may bind to an electricalcontact on the MEMS device to electrically and mechanically connect theflexible PCB board to the MEMS device. The electrical contacts on theMEMS device are soldered to the electrical contacts provided on thefirst and/or second extension portions of the flexible PCB board. Thiswill cause the electrical contacts to bind together thus mechanicallyand electrically connecting the MEMS device and flexible PCB board.

The flexible PCB board may be arranged such that an electrical contacton the flexible PCB board abuts an electrical contact on the MEMSdevice, so that the MEMS device is electrically connected to theflexible PCB board.

According to a further aspect of the present invention there is provideda projection system comprising any one of the above mentioned MEMSmicro-mirror assemblies.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be better understood with the aid of the descriptionof an embodiment given by way of example only and illustrated by thefigures, in which:

FIGS. 1a and b provide perspective views of a MEMS micro-mirror assemblyaccording to a first embodiment of the present invention; FIG. 1cprovides a perspective view illustrating how the MEMS micro-mirrorassembly of FIGS. 1a and 1b can be integrated into a projection device;

FIG. 2a provides a perspective view of a MEMS micro-mirror assemblyaccording to a further embodiment of the present invention; FIG. 2bprovides a perspective view illustrating how the MEMS micro-mirror ofFIG. 2a can be integrated into a projection device;

FIG. 3 provides a perspective view of a MEMS micro-mirror assemblyaccording to a further embodiment of the present invention;

FIG. 4 provides a perspective view of a MEMS micro-mirror assemblyaccording to a further embodiment of the present invention;

FIG. 5a provides a plan view of a known MEMS micro-mirror device; FIG.5b provides a cross sectional view of the MEMS micro-mirror device shownin FIG. 5a , taken along line A-A′ of FIG. 5 a;

FIG. 6 provides a plan view of another known MEMS micro-mirror device.

DETAILED DESCRIPTION OF THE DRAWINGS

FIGS. 1a and 1b provide perspective views of a MEMS micro-mirrorassembly 250 according to a first embodiment of the present invention.The MEMS micro-mirror assembly 250 comprises a MEMS device 240 mountedon a flexible PCB board 205.

The MEMS device 240 comprises a MEMS die 241 and a magnet 231. The MEMSdevice 240 is mechanically connected to the flexible PCB board 205 bymeans of glue which is provided between the magnet 231 and the flexiblePCB board 205. It will be understood that the MEMS device 240 may bemechanically connected to the flexible PCB board 205 using any suitablemeans.

The MEMS die 241 may comprise any of the features of the MEMS die 10,90of the MEMS devices 1,20 mentioned in the introduction. In this example,the MEMS die 241 comprises a first support frame 2, first and secondtorsional arms 3 a,b, a moveable part 4, a MEMS micro-mirror 8, and afirst actuation coil 5. In particular it should be noted that in thisembodiment the moveable part 4 is magnetically actuated in the samemanner as described for MEMS devices 1,20. The MEMS die 241 furthercomprises two electrical contacts 255 a,b which can be used toelectrically connect the MEMS device 240 to the flexible PCB board 205.

The flexible PCB board 205 comprises a portion 205 a on which the MEMSdevice 240 is mounted and a first extension portion 205 b.

The first extension portion 205 b comprises two electrical contacts 253a,b. In this example a plurality of wire bonds 252 electrically connecteach of the two electrical contacts 253 a,b on the first extensionportion 205 b of flexible PCB board 205, to the two electrical contacts255 a,b provided on the MEMS device 240, so as to electrically connectthe MEMS device 240 to the flexible PCB board 205. Specifically, in thisexample two wire bonds 252 electrically connect each electrical contact253 a,b on the first extension portion 205 b of the flexible PCB board205 to each electrical contact 255 a,b on the MEMS device 240. It willbe understood that any number of electrical contacts may be provided onthe first extension portion 205 b of the flexible PCB board 205 or MEMSdevice 240 and any number of wire bonds 252 may be used to establishelectrical connection between said contacts; using two or more wirebonds 252 to establish electrical connection will provide a more robustelectrical connection because if one of the wire bonds 252 should break,the MEMS device 240 will still be electrically connected to the flexiblePCB board 205 by means of the other, unbroken, wire bonds 252.

As shown in FIG. 1b the MEMS micro-mirror assembly 250 may optionallycomprise a protective material 261 which is arranged to form anenclosure 263 which encloses the plurality of wire bonds 252. Theprotective material 261 protects the wire bonds 252 from mechanicaltearing and or shearing and from dust and humidity.

The first extension portion 205 b of the flexible PCB board 205 furthercomprises two electrical contacts 259 a,b which are useable toelectrically connect the MEMS micro-mirror assembly 250 to anotherelectrical component. For example, if the MEMS micro-mirror assembly 250is to be integrated into a projection device, the electrical contacts259 a,b can be used to electrically connect the MEMS micro-mirrorassembly 250 to the appropriate electrical contacts provided in theprojection device so that the MEMS micro-mirror assembly 250 becomesintegrated in the projection device. In this example the electricalcontacts 259 a,b further comprise metalized vias 258 a,b. In this case,a metalized via can be used to electrically connect the top of theflexible PCB to the top of another PCB placed underneath, the electricalconnect is then done by providing metal in the vias, that by capillaritywill, connect all the pads of both PCB (the flex PCB and the other PCB).

The flexible PCB board 205 further comprises conductive lines 257 a,b,which are arranged to electrically connect the electrical contacts 253a,b to the electrical contacts 259 a,b.

FIG. 1c illustrates how the MEMS micro-mirror assembly 250 can beintegrated into a projection device 803 (or any other device or system).The first extension portion 205 b of the flexible PCB board 205 isflexed so that the electrical contacts 259 a,b of the MEMS micro-mirrorassembly 250 abut with, or attach to, electrical contacts 801 a,bprovided on a part 800 of the projection device 803. The MEMSmicro-mirror assembly 250 is thus electrically connected to theelectrical contacts 801 a,b provided on the part 800 of the projectiondevice and is integrated into the projection device 803.

Advantageously, since the PCB board 205 is a flexible PCB board 205 itmay be flexed to allow the electrical contacts 259 a,b to directlycontact the electrical contacts 801 a,b provided on the part 800 of theprojection device 803. Thus, the use of a flexible PCB board 205obviates the need for fragile wire bonds 252 to electrically connect theMEMS micro-mirror assembly 250 to the appropriate electrical contacts801 a,b provided in the projection device 803. Accordingly, the MEMSmicro-mirror assembly 250 of the present invention enables easier andmore robust integration into a projection device 803 (or other device orsystem).

Disadvantageously, flexing the first extension portion 205 b of theflexible PCB board 205 may induce stress on the wire bonds 252.Accordingly, as the first extension portion 205 b of the flexible PCBboard 205 is flexed so that the electrical contacts 259 a,b directlycontact the electrical contacts 801 a,b provided on the part 800 of theprojection device 803, the wire bonds 252, which electrically connectthe MEMS device 240 to the flexible PCB board 205, may break. FIG. 2aprovides a perspective view of a MEMS micro-mirror assembly 300according to another embodiment of the present invention, whichaddresses this problem.

The MEMS micro-mirror assembly 300 shown in FIG. 2a has many of the samefeatures as the MEMS micro-mirror assembly 250 shown in FIG. 1 and likefeatures are awarded the same reference numbers.

The first extension portion 205 b comprises two electrical contacts 259a,b which are useable to electrically connect the MEMS micro-mirrorassembly 300 to another electrical component.

The flexible PCB board 205 of the MEMS micro-mirror assembly 300 furthercomprises a second extension portion 205 c which comprises twoelectrical contacts 253 a,b to which the MEMS device 240 is electricallyconnected. Importantly, unlike the MEMS micro-mirror assembly 250 shownin FIGS. 1a and 1 b, the two electrical contacts 253 a,b on the flexiblePCB board 205 to which the MEMS device 240 is electrically connect arenot provided on the first extension portion 205 b, rather they areprovided on the second extension portion 205 c.

A plurality of wire bonds 252 electrically connect the two electricalcontacts 253 a,b provided on the second extension portion 205 c of theflexible PCB board 205 to the two electrical contacts 255 a,b providedon the MEMS device 240, so as to electrically connect the MEMS device240 to the flexible PCB board 205. In this example two wire bonds 252electrically connect each electrical contact 253 a,b on the secondextension portion 205 c of the flexible PCB board 205, to eachelectrical contact 255 a,b on the MEMS device 240. However, it will beunderstood that any number of electrical contacts may be provided on thesecond extension portion 205 c of the flexible PCB board 205 or MEMSdevice 240, and any number of wire bonds 252 may be used to establishelectrical connection between said contacts. Using two or more wirebonds 252 will provide a more robust electrical connection because ifone of the wire bonds 252 should break, the MEMS device 240 will stillbe electrically connected to the flexible PCB board 205 by means of theother, unbroken, wire bonds 252

Since, in the MEMS micro-mirror assembly 300, the MEMS device 240 iselectrically connected to the flexible PCB board 205 by means of wirebonds 252 which connect to electrical contacts 253 a,b provided on thesecond extension portion 205 c of the flexible PCB board 205, little orno stress is induced in the wire bonds 252 when the first extensionportion 205 b of the flexible PCB board 205 is flexed. Accordingly,there is reduced risk of the wire bonds 252 breaking when the firstextension portion 205 b of the flexible PCB board 205 is flexed tointegrate the MEMS micro-mirror assembly 300 into a projection device803 (or other device or system).

FIG. 2b illustrates how the MEMS micro-mirror assembly 300 can beintegrated into a projection device 803 (or any other device or system),the electrical contacts 259 a,b being used to electrically connect theMEMS micro-mirror assembly 300 to the electrical contacts 801 a,bprovided on the part 800 of the projection device 803.

The first extension portion 205 b of the flexible PCB board 205 isflexed so that the electrical contacts 259 a,b of the MEMS micro-mirrorassembly 300 abut with, or attach to, electrical contacts 801 a,bprovided on a part 800 of the projection device 803. As the firstextension portion 205 b of the flexible PCB board 205 is flexed whilethe second extension portion 205 c remains undistorted.

Advantageously, since the PCB board 205 is a flexible PCB board 205 thefirst extension portion 205 b may be flexed so that the electricalcontacts 259 a,b directly contact the electrical contacts 801 a,bprovided on the part 800 of the projection device 803, so as tointegrate the MEMS micro-mirror assembly 300 into the projection device803. Thus, the use of a flexible PCB board 205 obviates the need forfragile wire bonds 252 to electrically connect the MEMS micro-mirrorassembly 300 to the electrical contacts 801 a,b provided on the part 800of the projection device 803. Accordingly, the MEMS micro-mirrorassembly 300 enables easier and more robust integration into aprojection device (or other device or system). Furthermore, as the MEMSdevice 240 is electrically connected to the flexible PCB board 205 bymeans of wire bonds 252 which connect to electrical contacts 253 a,bprovided on the second extension portion 205 c of the flexible PCB board205, little or no stress is induced in the wire bonds 252 when the firstextension portion 205 b of the flexible PCB board 205 is flexed so thatthe electrical contacts 259 a,b directly contact the electrical contacts801 a,b provided on the part 800 of the projection device 803.Accordingly, there is a reduced risk of the wire bonds 252 breaking whenthe first extension portion 205 b of the flexible PCB board 205 isflexed to integrate the MEMS micro-mirror assembly 300 into theprojection device 803 (or other device or system).

FIG. 3 provides a perspective view of a MEMS micro-mirror assembly 400according to a further embodiment of the present invention. The MEMSmicro-mirror assembly 400 shown in FIG. 3 has many of the same featuresas the MEMS micro-mirror assembly 250 shown in FIG. 1 and like featuresare awarded the same reference numbers.

In the MEMS micro-mirror assembly 400 the flexible PCB board 205 isinterposed between the MEMS die 241 and a magnet 231. The MEMS device240 is mechanically connected to the flexible PCB board 205 by means ofglue 430 which is provided between the magnet 231 and a first surface402 of the flexible PCB board 205 and between the MEMS die 241 and asecond, opposite, surface 403 of the flexible PCB board 205. It will beunderstood that any suitable glue maybe used.

Advantageously, in the MEMS micro-mirror assembly 400, shorter wirebonds 252 are required to electrically connect the MEMS device 240 tothe flexible PCB board 205.

FIG. 4 provides a perspective view of a MEMS micro-mirror assembly 270according to a further embodiment of the present invention. The MEMSmicro-mirror assembly 270 has many of the same features as the MEMSmicro-mirror assembly 250 shown in FIGS. 1a and 1b and like features areawarded the same reference numbers.

In this embodiment the MEMS device is not mounted on the flexible PCBboard. In the MEMS micro-mirror assembly 270 the electrical contacts 253a,b on the flexible PCB board 205 are not connected to the electricalcontacts 255 a,b on the MEMS device 240 by means of wire bonds 252;rather the flexible PCB board 205 is arranged so that the electricalcontacts 253 a,b on the flexible PCB board 205 are connected directly tothe electrical contacts 255 a,b on the MEMS device 240. Specifically,the electrical contacts 255 a,b on the flexible PCB board 205 aresoldered to the electrical contacts 253 a,b on the MEMS device 240 so asto electrically and mechanically connected the MEMS device 240 to theflexible PCB board 205. The electrical contacts 255 a,b 253 a,b may eachcomprise Anisotrope Conductive Film (ACF)

It will be understood that in each of the above described embodiments,each of the electrical contacts 253 a,b on the flexible PCB board 205may be configured so that they are accessible from opposite sides of theflexible PCB board 205 (e.g. accessible at the first and second surfaces402,403 of the flexible PCB board 205); for example the electricalcontacts 253 a,b may be provided in through holes which are defined inflexible PCB board 205, so that the electrical contacts 253 a,b areaccessible from opposite sides of the flexible PCB board 205.Alternatively the electrical contacts 253 a,b may be wrapped around aside edge of the flexible PCB board 205 so that a portion of eachelectrical contact 253 a,b extends along the opposite surfaces of theflexible PCB board 205 (e.g along the first and second surfaces 402,403of the PCB board). Advantageously, electrical contact with theelectrical contacts 253 a,b can then be achieved from opposing sides ofthe flexible PCB board 205 e.g. at both first and second surfaces402,403 of the flexible PCB board 205.

It will also be understood that any of the electrical contacts providedon the flexible PCB board or on the MEMS device may each compriseAnisotrope Conductive Film (ACF).

It should be understood that the flexible PCB boards 205, in each of theabove mentioned embodiments, may be further mounted on a metallic plate;the MEMS device may be maintained attached to the metallic plate bymeans of the magnetic attraction force between the magnet and the metalplate, thereby obviating the need for glue.

Various modifications and variations to the described embodiments of theinvention will be apparent to those skilled in the art without departingfrom the scope of the invention as defined in the appended claims.Although the invention has been described in connection with specificpreferred embodiments, it should be understood that the invention asclaimed should not be unduly limited to such specific embodiment.

1-15. (canceled).
 16. An apparatus comprising: a microelectromechanicalsystem (MEMS) device; and a flexible printed circuit board (PCB) coupledto the MEMS device, the flexible PCB comprising at least one electricalcontact operable to couple the MEMS device to another electricalcomponent.
 17. The apparatus of claim 16, the MEMS device mounted on theflexible PCB.
 18. The apparatus of claim 16, the MEMS device comprisinga coil, the at least one electrical contact electrically coupled to thecoil.
 19. The apparatus of claim 16, the MEMS device a mirror tooscillate about at least one axis.
 20. The apparatus of claim 16, theflexible PCB comprising a first alignment mark, the first alignment markcomprising an indication of a location on the flexible PCB to attach theMEMS device.
 21. The apparatus of claim 20, the flexible PCB comprisinga second alignment mark, the second alignment mark comprising anindication of a location on the flexible PCB to attach a magnet, themagnet to provide a magnetic field to actuate the MEMS device.
 22. Theapparatus of claim 16, the flexible PCB comprising at least onereinforced area.
 23. The apparatus of claim 22, the at least onereinforced area thicker than other areas of the flexible PCB.
 24. Theapparatus of claim 16, a length of at least one dimension of theflexible PCB board substantially the same as a length of at least onedimension of the MEMS device.
 25. A system comprising: a light source toemit a light beam; a microelectromechanical system (MEMS) devicecomprising a micro-mirror to oscillate about at least one oscillationaxis, the micro-mirror in an optical path of the light beam; and aflexible printed circuit board (PCB) coupled to the MEMS device, theflexible PCB comprising at least one electrical contact operable tocouple the MEMS device to another electrical component.
 26. The systemof claim 25, the MEMS device mounted on the flexible PCB.
 27. The systemof claim 25, the MEMS device comprising a coil, the at least oneelectrical contact electrically coupled to the coil.
 28. The system ofclaim 25, the flexible PCB comprising a first alignment mark, the firstalignment mark comprising an indication of a location on the flexiblePCB to attach the MEMS device.
 29. The system of claim 28, the flexiblePCB comprising a second alignment mark, the second alignment markcomprising an indication of a location on the flexible PCB to attach amagnet, the magnet to provide a magnetic field to actuate the MEMSdevice.
 30. The system of claim 29, comprising the magnet.
 31. Thesystem of claim 25, the flexible PCB comprising at least one reinforcedarea.
 32. The system of claim 31, the at least one reinforced areathicker than other areas of the flexible PCB.
 33. The system of claim25, a length of at least one dimension of the flexible PCB boardsubstantially the same as a length of at least one dimension of the MEMSdevice.
 34. The system of claim 25, comprising the another electricalcomponent, the another electrical component a power source.
 35. Anapparatus comprising: a die comprising a microelectromechanical system(MEMS) device; and a flexible printed circuit board (PCB) coupled to theMEMS device, the flexible PCB comprising at least one electrical contactoperable to couple the MEMS device to another electrical component. 36.The apparatus of claim 35, the die mounted to a first side of theflexible PCB.
 37. The apparatus of claim 35, the at least one electricalcontact comprising a first electrical contact and a second electricalcontact, the second electrical contact redundant to the first electricalcontact.
 38. The apparatus of claim 35, comprising at least one wirebond to electrically couple the at least one electrical contact to theMEMS device.